Custom Printed Circuit Board Assembly Service

M.A.K.S, Incorporated is an Original Design Manufacturer (ODM). We offer a full range of PCB services including engineering, design, layout, quick-turn and prototype Printed Circuit Board (PCB) procurement, custom PCB assembly, complete box build assembly, wiring, component programming, rework and BGA reball and bonding to customers across a wide spectrum of industries. Our staff of experienced professionals can take your design idea and develop it from concept to finished product. Our capabilities include reverse engineering, sourcing, comprehensive inspection, repair and testing.

Dedicated to producing error-free high quality products, our engineering and design staff utilize top industry design tools and run full simulations before implementing the PCB layout. We specialize in PCB types such as: single and double sided, multi-layer, rigid or flexible construction, with flip chip and wire bonding. We can handle up to 64 layers. We offer a wide range of assembly methods which can accommodate almost any PCB assembly requirement. Automated assembly, hand insertion, hand soldering, point-to-point wiring, reflow and selective soldering are in our arsenal.

We are capable of handling Thru-Hole and Surface Mount Technology (SMT), including BGA and Micro BGA devices. Our box build services can accommodate board lengths up to 16" and board widths up to 12". Our manufacturing process utilizes solder reflow ovens that feature profile control and adjustment, with 10 zones of temperature control and 4 active cooling zones, enabling us to manufacture densely populated SMT PCB's with fine-pitch devices on both sides of the board.

Our state of the art, 17,514 sq. feet, static-free facility also includes equipment for screen printing solder paste, pick-and-place component handling and batch washing of completed assemblies. Solder paste types include water soluble and no clean.

We employ an electrical and physical verification system to maintain our high standards of quality. Our inspection capabilities include manual, Automated Optical Inspection (AOI) and X-ray. Our advanced manufacturing processes are augmented by a complete line of testing options including In-Circuit Test, Bed of Nails Test, Functional Testing and Burn-In Testing.

For more information, please see the table below or contact us directly.

Printed Circuit Board Assembly Capabilities

Additional Information

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