Electronic Design, Electronic Manufacturing, Product Development

Custom Printed Circuit Board Assembly Service

M.A.K.S, Incorporated is an Original Design Manufacturer (ODM). We offer a full range of PCB services including engineering, design, layout, quick-turn and prototype Printed Circuit Board (PCB) procurement, custom PCB assembly, complete box build assembly, wiring, component programming, rework and BGA reball and bonding to customers across a wide spectrum of industries. Our staff of experienced professionals can take your design idea and develop it from concept to finished product. Our capabilities include reverse engineering, sourcing, comprehensive inspection, repair and testing.

Dedicated to producing error-free high quality products, our engineering and design staff utilize top industry design tools and run full simulations before implementing the PCB layout. We specialize in PCB types such as: single and double sided, multi-layer, rigid or flexible construction, with flip chip and wire bonding. We can handle up to 64 layers. We offer a wide range of assembly methods which can accommodate almost any PCB assembly requirement. Automated assembly, hand insertion, hand soldering, point-to-point wiring, reflow and selective soldering are in our arsenal.

We are capable of handling Thru-Hole and Surface Mount Technology (SMT), including BGA and Micro BGA devices. Our box build services can accommodate board lengths up to 16" and board widths up to 12". Our manufacturing process utilizes solder reflow ovens that feature profile control and adjustment, with 10 zones of temperature control and 4 active cooling zones, enabling us to manufacture densely populated SMT PCB's with fine-pitch devices on both sides of the board.

Our state of the art, 17,514 sq. feet, static-free facility also includes equipment for screen printing solder paste, pick-and-place component handling and batch washing of completed assemblies. Solder paste types include water soluble and no clean.

We employ an electrical and physical verification system to maintain our high standards of quality. Our inspection capabilities include manual, Automated Optical Inspection (AOI) and X-ray. Our advanced manufacturing processes are augmented by a complete line of testing options including In-Circuit Test, Bed of Nails Test, Functional Testing and Burn-In Testing.

For more information, please see the table below or contact us directly.

Printed Circuit Board Assembly Capabilities

General Services  
Engineering Services
Circuit Design
Printed Circuit Board Layout
Board Fabrication/ PCB Sourcing
Component Sourcing and Kitting
Component Programming
Turnkey Assembly 
Consignment Assembly or (Mixed Model) 
SMT Assembly
Thru-Hole Assembly
Electro-Mechanical Assembly
Wiring Harness
Box Build Assembly
Repair/Rework
Reball
Bonding
Inspection
Testing
Harsh Environment Protection 
Conformal Coating
Encapsulation
Potting
Packaging
Quick-Turn Availability
17,514 Sq. Feet, Static-Free Environment
Circuit Board Construction  
Rigid
Flex
Single Sided
Double Sided
Multi-Layer
Mixed Technology (SMT and Thru Hole)
Solder Paste Type  
Leaded

Lead-Free 

Water Soluble

No Clean

PCB Materials  
Fiberglass
FR-4
Getek
Kevlar
Mylar
Phenolic
Polyester
Polyimide
Teflon
Number of Board Layers  
Min
1 layers
Max
64 layers
Circuit Board Features   Flip Chip
Wire Bonding
Component Capability  
Thru-Hole
SMT
01005
0201
0402
0603
0805 and larger
TSSOP
BGA
Micro BGA
QFN
Assembly Methods  
Automated Assembly
Hand Insertion
Hand Soldering
Point-to-Point Wiring
Reflow
Selective Solder
Board Length   Up to 16 in
Board Width   Up to 12 in
Equipment   Screen Printer/Solder Paste Machines
ERSA Versaprint P1
EKRA E4
Pick and Place Machines
MYDATA MY100sxe
MYDATA MY100sx
MYDATA MY9E
Reflow Ovens, Nitrogen Capable for Lead Free Solder
ERSA Hotflow 3/20
ERSA 3/20e
Selective Soldering Machines
ERSA Ecoselect
Aqueous Batch Washer/Clean & No-Clean Boards
Technical Devices Nu/Clean D.I. Elite Plus+++
Automated Optical Inspection (AOI)
Nordson Yestech BX AOI
X-Ray Inspection System
Glenbrook Technologies RTX-113HV
BGA/QFN Repair Station
Martin DBL-05
Potting Machines
Sealant Equipment See-Flow 387
Reflow Oven  
Long Process
Profile Control / Adjustment
10 Zone
4 Active Cooling Zones
Testing  
In-Circuit Test
Bed of Nails Testing
Functional Testing
Burn-In Testing
Inspection   Optical (Manual and Automated)
X-Ray
Quality Control  
Online Procedures and Documentation
Hard Copy Work Instructions and                                  Documentation
Component Check
PPAP (Pre-Production Approval Process)
Physical Verification
Electrical Verification
Production Volume   Prototype to Medium Volume

 

Additional Information

Industry Focus  
Aerospace
Automotive
Commercial
Electronics
Industrial
Medical
Scientific
Industry Standards  
ANSI/J-STD*
CSA
FCC
IP (Ingress Protection Rating)
IEC
IPC*
RoHS (Restriction of Hazardous Substances)
TUV
UL

ISO 9001 Certification pending audit


*(All assemblies built to the latest IPC-A-610 & ANSI/J-STD-001 standards - Class II and Class III)

Software (Assembly Process)   Mentor Graphics CAMCAD
MYDATA MYCenter (Offline Productivity Software Suite)
MYDATA MYPlan (Production Planning Software)
Unisoft Factory 2000 (Placement Programming Data Generator)
File Formats Accepted (others acceptable, please inquire)  
Accel PCAD (*.PDF)
Accel Tango (*.PCB)
Altium Designer (*.PCBDoc)
AutoCAD (*.DXF)
CAD-Star (*.CDI)
Cadence OrCAD Layout (*.MIN)
Cadence OrCAD PCB Editor (*.BRD)
GenCAD (*.CAD)
GenCAM (*.GCM)
Gerber
HPGL
IGES
IPC-D-356
Mentor Graphics PADS (*.ASC)
Mentor Neutral Files (*.NEU)
ODB++
Protel (*.PRO)
Veribest (*.VRB)

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